chargebyte launches open-source high-power charging controller

German charging communication specialist chargebyte is launching the Charge Control V (CCV), which it says is the world’s first ready-to-deploy high-power charging controller built on the EVerest open-source firmware stack. The CCV is currently in pre-series status with samples available for pre-order.

The CCV is a 2-port charging controller for CCS-based charging stations, handling two charging ports while also integrating a dedicated safety co-processor and enough processing power to drive a high-resolution display directly. It includes extensive I/Os for peripheral devices and is positioned as both a platform for new charger designs and a drop-in replacement for legacy controllers. The board runs EVerest with full support for ISO 15118-20 and OCPP 2.1.0. Firmware maintenance is included in the product price, and because the underlying stack is open source, operators can modify or extend it freely without being tied to chargebyte for software updates or customization.

Most commercial HPC controllers ship with proprietary firmware, creating ongoing dependency on the vendor for protocol updates, feature additions and certification maintenance. Building on EVerest—which is maintained as a community project under LF Energy—gives integrators a path to genuine software independence at the controller level.

chargebyte is also debuting two MCS (Megawatt Charging System) controllers at Power2Drive aimed at e-trucks and heavy-duty commercial vehicles. The CCL MCS sits on the vehicle side, handling charging communication and safety logic between the charging inlet and vehicle electronics per ISO 15118-20. The CCY MCS mirrors that capability on the infrastructure side. Together they form an end-to-end MCS solution covering both vehicle and charger integration.

Source: chargebyte

from Charged EVs https://ift.tt/1f7dz5C

JEDEC releases two SiC reliability guidelines for power conversion

JEDEC’s JC-70.2 Silicon Carbide Subcommittee has published two new free guidelines—JEP203 and JEP204—standardizing how engineers evaluate and qualify SiC power devices in EV inverters, industrial drives and energy infrastructure.

JEP203, Guideline for Short Circuit Evaluation in Power Conversion Transistors, addresses short-circuit capability testing for power MOSFETs. Short-circuit behavior is a particular concern with SiC: unlike silicon IGBTs, SiC MOSFETs typically have shorter short-circuit withstand times, which puts tighter demands on protection circuit design and gate driver response. Without a standard test methodology, results have varied across vendors and test labs, complicating design decisions for system engineers. JEP203 provides a shared evaluation framework to improve protection design consistency and make device-to-device comparisons more meaningful.

JEP204, Catalog of Stress Procedures for Silicon Carbide Devices for Power Electronic Conversion, is a broader reliability reference covering stress procedures across reliability, environmental and ruggedness categories. It gives qualification engineers and device manufacturers a common testing vocabulary for evaluating long-term SiC device performance—something the industry has lacked as SiC adoption has outpaced formal standardization.

Both documents are available for free download from JEDEC’s website.

JEDEC’s JC-70 committee now has more than 70 member companies—up from 23 at its founding in October 2017—including SiC and GaN semiconductor makers, power device users and test and measurement suppliers.

“JEP203 and JEP204 are landmark guidelines for SiC power conversion, enabling the industry to confidently adopt silicon carbide in demanding power electronic applications,” said Dr. Donald Gajewski, Wolfspeed Senior Director Reliability Engineering and chair of the 702_1 Task Group. “JEP204 provides a comprehensive framework of best practices for stressing SiC power devices, offering significant value to both users and suppliers.”

Source: JEDEC

from Charged EVs https://ift.tt/JaSVygX

ROHM brings TO-247-class cooling to surface-mount SiC MOSFET package

ROHM Semiconductor has launched the TSC3PAK, a new package for SiC MOSFETs that delivers heat dissipation performance comparable to conventional TO-247-4L through-hole packages while being fully compatible with automated surface-mount assembly. Mass production started this month.

Through-hole SiC packages like the TO-247 dissipate heat well but require manual mounting, can’t support pick-and-place automation, and have a taller profile that limits board density. Surface-mount alternatives have existed but typically traded away heat dissipation to get there. ROHM’s TSC3PAK (14.00 × 18.58 × 3.50 mm) uses a top-side heat dissipation structure—the heat spreader faces up rather than down toward the PCB—to achieve comparable thermal performance to TO-247 in a surface-mount footprint.

The package incorporates ROHM’s proprietary groove structure to achieve a 6.66 mm creepage distance, supporting AC peak voltages up to 1,200 V in a Pollution Degree 2 environment. That voltage rating matters for OBC and electric compressor applications, where the 800 V battery systems increasingly common in EVs push voltage requirements well past what conventional 650 V or 900 V packages can safely handle. The devices inside use ROHM’s 4th Generation SiC MOSFETs, which the company says deliver low on-resistance and high-speed switching to reduce switching losses in power conversion stages.

Automotive applications include onboard chargers and electric compressors. Industrial applications include PV inverters and server power supplies.

Source: ROHM Semiconductor

from Charged EVs https://ift.tt/1vmD0rg

SINBON Electronics debuts EV charging products in Europe

Taiwan-based SINBON Electronics has developed a European-standard EV charging product portfolio for the European market, including Type 2 AC charging cables, CCS2 DC charging cables, CCS2 liquid-cooled charging cables and CCS2 charging inlets.

Included in the portfolio is an upgraded lightweight CCS2 DC charging cable designed to enhance user convenience and ergonomic design while maintaining high power output and compliance with European safety standards.

SINBON has also partnered with Swobbee, a European battery-swapping infrastructure platform and Taiwanese hydrogen technology firm Nexcellent Energy to develop an integrated urban energy solution encompassing battery swapping and hydrogen refueling.

Swobbee provides battery swapping services for micro-mobility vehicles, while Nexcellent Energy specializes in hydrogen technology R&D.

Source: SINBON Electronics

from Charged EVs https://ift.tt/UKBo6Tb

onsemi launches online tool for pairing SiC MOSFETs with gate drivers

onsemi has launched the Elite Pairing Studio, a cloud-based design environment that helps engineers find and evaluate matched combinations of SiC MOSFETs and gate drivers before committing to a full system-level simulation.

Getting the SiC MOSFET and gate driver pairing right matters more than it might seem. The gate driver’s output current, timing and voltage levels directly shape the switching waveform, which determines switching losses, voltage overshoot relative to device ratings and EMI behavior. A poor pairing can push those parameters out of bounds even if each device individually looks fine on paper.

Traditionally, working that out required iterating through datasheets, running spreadsheet calculations and building test circuits. The Elite Pairing Studio is built around onsemi’s own device portfolio and runs those evaluations automatically, outputting switching timings, gate voltage and current waveforms, voltage overshoot margins and turn-on/turn-off energy losses through an interactive waveform viewer. The underlying calculation methods are transparent and inspectable, based on established industry equations rather than black-box simulation.

The tool is the entry point to onsemi’s broader simulation stack. Engineers can take the pairing they’ve selected and export PLECS-compatible system-level models to carry the analysis forward into onsemi’s Elite Power Simulator for full efficiency, thermal and loss evaluation. onsemi says additional device technologies will be added to the Studio in the future.

Target applications include EV traction inverters, onboard chargers, AI data center power supplies and industrial motor drives.

Source: onsemi

from Charged EVs https://ift.tt/2kbfPsv

Logistics firm ArcBest evaluates Tesla Semis in its ABF Freight fleet

ArcBest, an integrated logistics company, has announced the purchase of two Tesla Semi Class 8 electric trucks by its less-than-truckload carrier ABF Freight.

The company tested the Semis in a 2025 pilot, which focused mainly on the Reno-Sacramento corridor. In the next phase of testing, ABF will evaluate performance across a broader segment of its network before making additional investment decisions.

The company plans to benchmark the electric trucks against its diesel fleet using “the same approach to total cost of ownership, operational efficiency, safety and employee experience that guides fleet investments across the business.”

During the 2025 pilot, the Tesla Semi achieved an average energy efficiency of around 1.55 kWh per mile. Driver feedback from the pilot was positive. Operators highlighted visibility, comfort and overall performance, including operation on demanding routes such as the 7,200-foot climb over the Donner Pass.

ABF expects to gain additional insight into the everyday performance of the Teslas by expanding deployment to additional lanes and driver groups.

“Our 2025 pilot gave us valuable insight into how electric Class 8 equipment can perform in real-world LTL operations,” said Matt Godfrey, President of ABF Freight. “Adding Tesla Semis to our lineup allows us to expand that across more lanes and operating conditions to evaluate whether heavy-duty electric vehicles meet the same standards for safety, reliability and performance across our existing fleet.”

Source: ArcBest

from Charged EVs https://ift.tt/J3P02yK

Mitsubishi’s new Eclipse Sportback EV to go on sale in North America this year

Mitsubishi Motors North America has released the first images of the 2027 Mitsubishi Eclipse Sportback, a new battery-electric subcompact SUV.

Working with partner Nissan, Mitsubishi will introduce the Eclipse Sportback EV to the North American market as a 2027 model in the second half of 2026. The Eclipse Sportback EV is based on the next-generation Nissan LEAF, but it will feature cosmetic design changes that “differentiate the two vehicles and make the model distinctively Mitsubishi.” No more details are on offer at the moment.

Mitsubishi’s electrification efforts began in the 1970s with some experimental electric vehicles in Japan. The i-MiEV, one of the world’s first mass-produced EVs, went on sale in 2009 and arrived in the US and Canada in 2011. Partners Citroen and Peugeot released rebadged versions (the Peugeot iOn and the Citroen C-ZERO), which can still be seen on European streets. A racing version, the i-MiEV Evolution, made a respectable showing at the 2012 Pikes Peak International Hill Climb. The Outlander PHEV, a far more advanced vehicle, arrived in North America in 2018.

Source: Mitsubishi Motors

from Charged EVs https://ift.tt/Vnz12Ov