Infineon and Schweizer collaborate on silicon carbide-based power chip embedding

Infineon Technologies and Schweizer Electronic are working to embed Infineon’s 1,200 V CoolSiC silicon carbide-based chips directly onto printed circuit boards (PCBs).

The two companies have embedded a 48 V MOSFET on the PCB, showing the potential of their new chip embedding approach. The performance increased by 35% and demonstrated power semiconductors can be incorporated onto PCBs using Schweizer’s p² Pack technology. Chip embedding enables highly integrated and efficient inverters that reduce overall system costs, according to Infineon.

“Infineon’s 100% electrically tested standard cells (S-Cell) can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, VP of Technology at Schweizer Electronic. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”

Source: Infineon Technologies

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