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Monday, December 16, 2024

Wevo-Chemie unveils silicone thermal gap filler for power electronics and batteries


German adhesives and sealants producer Wevo-Chemie is expanding its portfolio of thermal interface materials with an optimized silicone gap filler.

WEVOSIL 26040 FL features high thermal conductivity of 4 W/m*K for efficient heat dissipation for large surfaces. The material has been formulated to be resistant to sedimentation, allowing it to be stored, used and transported over long distances for at least three months without having to be rehomogenized.

The material’s specially developed filler combination and the resulting low bond line thickness of <70 µm bridge small gaps. Material properties such as reactivity can be customized to individual needs, according to the company.

The optimized dosing properties permit simple and efficient handling, high dispensing speeds and fine dosing patterns. This ensures greater precision and flexibility in production compared to thermally conductive pads, particularly when manufacturing large unit volumes.

The filler provides high temperature resistance of up to 200° C, flame-retardant properties in accordance with UL 94 V-0 (as of a thickness of just 2 mm) and mechanical properties including elongation at break of more than 30%.

When cured, WEVOSIL 26040 FL meets the requirements of the PV 3040 test specification for low-volatile emissions in the automotive industry.

“Whether it’s high dosage volumes, reliable heat dissipation for large surfaces or mechanically demanding thermal joints that are needed, the new silicone gap filler from Wevo is a solution for numerous requirements in contemporary electronics and electrical engineering,” the company said.

Source: Wevo-Chemie



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